Rogers Ro4350b Price 4350B Material 0.508MM PCB For Web Server

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Rogers PCB material in stock normally :

Rogers 4350B

Rogers 4003C

Rogers 3003

RT5880

RT5870

Rogers High Frequency Laminates

3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer)

RO3000® series High Frequency Laminates (PTFE/Ceramic)

RO3035® series High Frequency Laminates (PTFE/Ceramic)

RO3200® series High Frequency Laminates (PTFE/Ceramic)

RO4000 High Frequency Laminate with TICER Foil

RO4000 laminates data sheet and fabrication guidelines: RO4003C, RO4350B

RO4400 prepreg data sheet and fabrication guidelines: RO4450B, RO4450F

RO4500 Antenna Grade Laminates for High Volume Applications

RT/duroid® 5870/5880 Glass Microfiber Reinforced PTFE Composites

RT/duroid 6002 laminate data sheet

RT/duroid 6006/6010 laminate data sheet

RT/duroid 6202 laminate data sheet

RT/duroid 6202PR laminate data sheet

TMM Thermoset laminate data sheet: TMM3, TMM4, TMM6, TMM10, TMM10i

ULTRALAM 2000 laminate data sheet

ULTRALAM 3000 LCP laminate data sheet: ULTRALAM 3850

ULTRALAM 3000 LCP Prepreg: ULTRALAM 3908

RO4350B™ Laminates

RO4350B™ materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.

Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.

RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.

Typical Applications

Cellular Base Station Antennas and Power Amplifiers

Microwave point to point (P2P) links

Automotive Radar and Sensors

RF Identification (RFID) Tags

LNB’s for Direct Broadcast Satellites

Rogers Material:

RT/duriod

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:
1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.
RO3000
RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:
1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.
RO4000
RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:
1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.
TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:
1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.